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L3 CS-East specializes in the design, development and production of secure communications systems and products. We have state-of-the-art surface-mount technology (SMT) equipment and assemble a wide variety of circuit cards. We also perform chassis, wire harness and mechanical assembly required to support production and development activities. Our clean, environmentally controlled facility is compliant to AS9100D/ ISO 9001:2015, ANSI-ESD-S20.20, MIL-STD-45662/ ISO 10012-1/ANSI/NCSL Z540. L3 CS-East is NASA and J-STD certified.

Printed Circuit Card Assembly includes:

  • Through-hole and SMT assembly, including fine-pitched components to 0201, standard and micro BGAs

  • Double-sided, multi-layer, including High-Density Interconnect (HDI) boards

  • High-density expertise (~500 joints/in2)

  • In-line automated product evaluation

  • Optical inspection

  • X-Ray

  • DEK 265 Horizon Solder Paste Stenciling Systems

  • CyberOptics SE300 Automated Solder Paste Inspection Systems

  • MYDATA and FUJI Placement Systems

  • FUJI High-speed Chipshooters

  • Heller Forced Convection Reflow Ovens

  • Beamworks Spark 400 Laser Soldering System

  • Teradyne In-Circuit Testers

Mechanical Assembly Equipment includes:

  • KOMAX Gamma 333 Automated Cut, Strip and Crimp System

  • KOMAX Kappa 210 Automatic Wire Cutter

  • Control Automation Laser Wire Stripping System

  • Schleuniger Automated Stripping Systems

  • Cable Scan Series 90 HV Test Systems