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Manufacturing

L3 CS-East specializes in the design, development and production of secure communications systems and products. We have state-of-the-art surface-mount technology (SMT) equipment and assemble a wide variety of circuit cards. We also perform chassis, wire harness and mechanical assembly required to support production and development activities. Our clean, environmentally controlled facility is compliant to AS9100C, ISO 9001:2008, ANSI-ESD-S20.20, MIL-STD-45662/ISO 10012-1/ANSI/NCSL Z540. L3 CS-East is NASA and J-STD certified.

Printed Circuit Card Assembly includes:

  • Through-hole and SMT assembly, including fine-pitched components to 0201, standard and micro BGAs

  • Double-sided, multi-layer, including High-Density Interconnect (HDI) boards

  • High-density expertise (~500 joints/in2)

  • In-line automated product evaluation

  • Optical inspection

  • X-Ray

  • DEK 265 Horizon Solder Paste Stenciling Systems

  • CyberOptics SE300 Automated Solder Paste Inspection Systems

  • MYDATA and FUJI Placement Systems

  • FUJI High-speed Chipshooters

  • Heller Forced Convection Reflow Ovens

  • Beamworks Spark 400 Laser Soldering System

  • Teradyne In-Circuit Testers

Mechanical Assembly  Equipment includes:

  • KOMAX Gamma 333 Automated Cut, Strip and Crimp System

  • KOMAX Kappa 210 Automatic Wire Cutter

  • Control Automation Laser Wire Stripping System

  • Schleuniger Automated Stripping Systems

  • Cable Scan Series 90 HV Test Systems